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LSResearch: TiWi-SL: 2.4GHzWLAN solution

LSResearch: TiWi-SL: 2.4GHzWLAN solution

TiWi-SL of LS Research is a high-performance 2.4GHz 802.11b/g WLAN module, including the necessary PHY, MAC and network layer to support WLAN applications. The module is compatible with IEEE 802.11b/g, WLAN transmission power is +19.0dBm or +15dBm, WLAN sensitivity is -85dBm or -70dBm, and working voltage is 2.9V~3.6V. Mainly used in HVAC control, smart grid, sensor network, medical treatment, home automation and monitoring.

TiWi-SL is a high-performance 2.4GHz WLAN module that includes an IP networking stack in a verified pin space.

This module includes the required PHY, MAC, and network layers to support WLAN applications through a simple SPI connection with the host microcontroller and other embedded processors.

LSResearch: TiWi-SL: 2.4GHzWLAN solution
Figure 1 Block diagram of TiWi-SL module
LSResearch: TiWi-SL: 2.4GHzWLAN solution
Figure 2 Outline drawing of experiment board and TiWi-SL EM board

Main features of TiWi-SL module

• Comply with IEEE 802.11b/g standard

•Typical WLAN transmit power: +19.0 dBm, 11 Mbps, CCK (b)

– +15dBm, 54 Mbps, OFDM (g)

• Typical WLAN sensitivity: -85 dBm, 8% PER, 11 Mbps

– -70dBm, 10% PER, 54Mbps

•Small point area: 14 mm×21mm

• Low profile height: 2.3 mm

•Working voltage: 2.9V~3.6V

•Working temperature: -40℃~+85℃

• Embedded network stack

• Wireless Security WEP, WPA Personal Edition, WPA2 Personal Edition

•Suitable for PCB/chip antenna feed terminal

• Compact design based on TI’s CC3000 transceiver

• SPI host interface

• Easy integration with the microprocessor of the microcontroller

•World recognition: FCC (United States), IC (Canada

Canada), ETSI (Europe)

• Comply with RoHS requirements

• Smooth development with LSR design service

TiWi-SL module application

• HVAC control, Smart Energy

•Sensor Networks

•Medical equipment

• Home automation

• Home surveillance

Main features of TiWi-SL module
LSResearch: TiWi-SL: 2.4GHzWLAN solution
Figure 3 TiWi-SL EM board circuit diagram

Table 1 Bill of Materials (BOM) of TiWi-SL EM Board

WLAN features:

• WLAN MAC baseband processor and RF transceiver compliant with IEEE802.11b/g

• Comply with IEEE Std 802.11d, i PICS standard

• Support serial debugging interface

• Support serial peripheral interface (SPI) host interface

•Media Access Controller (MAC)

– Embedded ARM Central Processing Unit (CPU)

-Using 64-bit, 128-bit WEP, TKIP or AES keys, hardware-based encryption/decryption

– Support wireless fidelity (Wi-Fi) protected access (WPA and WPA2.0) and IEEE requirements

– Std 802.11i

• Baseband processor

• 2.4GHz audio

– Adoption of Digital Audio Processor (DRP)

– Internal LNA

– Support: IEEE Std 802.11b, 802.11g, 802.11b/g support network stack protocol

• Transport layer

– TCP

– UDP

•Network layer

– IPv4

– Ping

– DHCP

-DNS client program

• Link layer

– ARP wireless security system features

•Supported modes

– Public (no security)

– WEP

– WPA-Personal Edition

– WPA2-Personal Edition

•Supported encryption type,

– WEP

– TKIP

– AES

– Open

The TiWi-SL EM evaluation module board is an evaluation platform for LS Research TiWi-SL 802.11 b/g Wi-Fi modules. The communication between the slave device and the master device TiWi-SL module is carried out through an SPI interface.

LSR 001-0001 dipole antenna is used to connect LSR 080-0001 U.FL to reverse pole SMA cable and Hirose PCB mounting type U.FL connector to provide an additional mounting antenna for the LSR TiWi-SL wireless module.

For details, see:

http://solution.eccn.com/solution_2012022111042685.htm

GEC

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